What’s Between Now and 2035???

My Conclusion on Si Architecture Trends and thier ecosystem impact

Today’s Si companies must track the key trends in Si technology development, assembly test, Nanotechnology, Cooling, Emerging Research, Virtualization, acceleration and Si Complex Architectures to help drive their product teams in close collaboration with other Si vendors to keep the enterprise in a thought leadership position contemporary with the Silicon Industry along with consumer demands.

This blog is intended to document key technology trends and issues I feel will have a major impact betwen now and 2035. The following areas will be covered:

Silicon technology, architecture  processes and innovation

  • Lithography Evolution enables “Moore than Moore”
  • Size, Nano-techniques & Subatomic wire
  • Cooling via refrigeration or wind
  • Cores, components and the Si complex
  • Thinner materials E.G., nanotubes & self assembly
  • Faster Transistors E.G., Ultrathin Graphene
  • Optical Computing, Molecular Computing
  • Quantum Computing, Biological Computing
TREND EXAMPLE
Integration Level Components/Chip,   Moore’s Law
Cost Cost   Per Function
Speed Microprocessor   Throughput
Power Laptop   or Cell Battery Life
Compactness Small   and Light-weight Products
Functionality Nonvolatile   Memory, Imager

Software As a Service
Cloud Computing SW & HW trends to watch
System Architecture

  • System Drivers
  • Design
  • Mixed-signal Tech in Wireless Communications
  • Emerging Research Devices
  • Front End Processes
  • Lithography
  • Interconnect
  • Factory Integration, Assembly & Test.

Enterprise IT Architecture
Applications Infrastructure as it relates to all of the above.

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